Measuring the bend of an electronic component lead
-
Industry:
- Electronic Devices, Metals
-
Products:
- Optical Metrology Systems
The pitch and position of the lead tip are measured. With an Image Dimension Measurement System, non-contact measurement can be performed without deformation. Simply press the [MEASURE] button to execute measurement and display the result, as shown below.
1. The center line of the case is detected.
2. The midpoint of the lead tip is detected.
3. The pitch of the lead tip and distance from the case center line are measured.
